HY568 is a one-component modified epoxy resin adhesive, referred to as epoxy folding adhesive, with 100% solid content, no solvent, no isocyanate, and no flow when cured by heating. It has excellent oil resistance, water resistance, acid and alkali resistance, chemical resistance, good corrosion resistance, and good heat resistance and moisture resistance.
Main chemical composition | Modified epoxy adhesive | |
Rubber appearance | Homogeneous paste, no particle agglomeration, no bubbles | |
Density (g/cm3) | 1.4±0.1 | |
Sag (mm) | ≤2 | |
Pressure flow viscosity (g/min) | 30~70 | |
Non-volatile matter (%) | ≥98 | |
Curing conditions (160℃, 30min) | Fully cured | |
Tensile shear strength MPa | 23℃ | ≥16 |
-40℃ | ≥16 | |
80℃ | ≥7 | |
Heat aging | ≥15 | |
Overbake resistance | ≥15 | |
Alternating resistance to cold and heat | ≥15 | |
Water resistance | ≥15 | |
Salt spray resistance test | ≥15 | |
Tear strength (N/25mm) | ≥50 | |
Cured appearance | The surface of the adhesive layer is not sticky, no cracks and bubbles, dense and no bubbles |