Product Usage
|
HY401 |
General purpose, medium viscosity, used for inert surfaces, bonding acidic, porous and absorbent materials. |
|
HY406 |
Low viscosity, used for bonding rubber, plastic and other materials. |
|
HY460 |
Low whitening, used for bonding electronic components with low whitening requirements. |
|
HY495 |
General purpose, low to medium viscosity. Used for bonding rubber, metal and plastic parts. |
|
HY496 |
Medium viscosity. Used for bonding metal and other materials. |
Product Performance
|
Model |
Color |
Curing Speed (25℃) |
Viscosity (mPa•S) |
Filling gap (mm) |
Shear strength (MPa) |
Working temperature (℃) |
|
|
Position |
Fully cured |
||||||
|
HY401 |
Transparence |
20s |
18h |
30~100 |
≤0.10 |
≥10 |
-60~90 |
|
HY406 |
Transparence |
15s |
18h |
5~40 |
≤0.10 |
≥10 |
-60~90 |
|
HY460 |
Transparence |
40s |
18h |
100~300 |
≤0.15 |
≥10 |
-60~90 |
|
HY495 |
Transparence |
20s |
18h |
50~150 |
≤0.15 |
≥10 |
-60~90 |
|
HY496 |
Transparence |
40s |
18h |
80~200 |
≤0.15 |
≥10 |
-60~90 |
Helen