HY484Electronic epoxy potting compound

Epoxy potting compound is a two-component, self-leveling, room temperature curing epoxy resin potting material with excellent aging resistance, moisture resistance, electrical insulation, high hardness and high breakdown voltage. It is suitable for various casting bonding and sealing of electronic components.

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product description

Scope of application
HY484T: Potting of electronic components and modules with transparent requirements, suitable for normal temperature potting of digital tubes.
HY484P: used for general electronic components potting and circuit board sealing protection.
HY484L: used for general electronic components potting and circuit board sealing protection.
HY484D: It is used for potting protection of modules and circuit boards that require high heat dissipation and flame retardant for high-power electronic components.
Product Features
1. Solvent-free, environmentally friendly and low-carbon
2. Excellent weather resistance, aging resistance, UV resistance
3. It is insulating, moisture-proof and shock-proof
4. Suitable for potting and sealing of electronic components
5. Non-corrosive
Curing mechanism
HY484 is an epoxy potting material, and its curing mechanism is to react and cure with a curing agent to become an elastic solid. The higher the temperature and humidity, the faster the cure; the slower the cure at low temperature and low humidity.
chemical resistance
The product can be resistant to fresh water, sewage, waste water, calcium carbonate aqueous solution, detergent, low acid, corrosive aqueous solution, etc. for a long time, and short-term resistance to mineral oil, vegetable oil, fat, fuel, organic solvent, paint thinner, high concentration acid Alkali etc.
Instructions
Preliminary preparation
Ensure that the potting surface is free of oil and dust. For long-term storage, due to the large proportion of group A, it is easy to delaminate. Before use, it should be stirred evenly and used without affecting the performance of the product.
mixed glue
Add the curing agent B into the rubber compound in proportion, pour it while stirring, be careful to scrape the wall, stir evenly, and have the same color.
The mixed glue should be used up within 0.5 hours.
Automatic mixing and filling machine can be used!
Precautions
1. For long-term storage, due to the large proportion of group A, it is easy to delaminate. Before use, it should be stirred evenly before use, which will not affect the performance of the product. Apply glue in a ventilated environment
2.The mixed glue should be used up at one time, and the unused glue and curing agent should be sealed and stored.
3.Generally, the thickness of potting is within 30mm. For deep potting, please contact the company.
Packaging Specifications
12kg/set 24kg/set

标签：Electronic epoxy potting compound

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HY484Electronic epoxy potting compound

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