Two-component thermal conductive Silicone Potting compound

Remark: Measured after curing for 7 days at temperature 25°C and 50% relative humidity.

Product Description

HY585 silicone potting sealant is a two-component, room temperature curing, condensation and dealcoholization type of silicone potting material. Self-leveling, high and low temperature resistance, excellent aging resistance, insulation, moisture resistance and shock resistance. Used in various bonding and sealing of electronic components.

Product Features

1. Solvent-free, environmentally friendly and low-carbon

2. Excellent weather resistance, aging resistance, UV resistance

3. It is insulation, moisture-proof, shock- resistance

4. Suitable for potting and sealing of electronic components

5. Non-corrosive

Main Applications

HY5850 silicone gel is suitable for sealing and protecting various electronic components, especially precision electronic components.

HY585T is suitable for potting and sealing of electronic components with transparency requirements.

HY584D is suitable for various potting and sealing of electronic components that have thermal conductivity and flame retardant requirements.

HY584H is suitable for potting and sealing of electronic components with high thermal conductivity requirements.

Curing Mechanism

HY584 is a silicone potting material. Its curing mechanism is to react and cure with a curing agent to become an elastic solid. The higher the temperature and the higher the humidity, the faster the curing, the curing speed would be the slower in the low temperature and low humidity environment.

Resistant to chemical media

The product can be resistant to fresh water, sewage, waste water, calcium carbonate aqueous solution, detergent, low acid, corrosive water solution, etc. for a long time. And can be short-term resistant to mineral oil, vegetable oil, fat, fuel. But can be not resistant to organic solvents, paint thinners, and high-concentration acids Alkali etc.

Instructions

Preliminary preparation

Ensure that the potting surface is free of oil and dust. Long-term storage is easy to layer due to its high specific gravity, so it should be mixed well before use, and the product performance will not be affected.

Mixed glue

According to the mass ratio (or volume ratio) of compound A: curing agent B=1:1, it is better to mix evenly and have the same color.

The mixed glue should be used up within 1 hour.

Sizing and curing

Pour the evenly mixed glue into the components in a thin stream and slowly to avoid entrapment in gas.

It is fully cured in 24 hours at room temperature; it is fully cured by heating at 60 degrees for 40 minutes; it is fully cured by heating at 80 degrees for 20 minutes.

After curing, use a blade to clean up the excess residual glue.

Automatic mixing and filling machine can be used!

Matters Needing Attention

1. Long-term storage. Since the AB component is a thermally conductive material, it is easy to layer due to its high specific gravity. It should be stirred well before use, and the product performance will not be affected. Use the glue in a ventilated environment.

2. The mixed glue should be used up at one time, and the unused glue and curing agent should be sealed and stored.

3. Avoid contacting the glue with the following materials: organotin compounds and silicone rubber containing organic tin, materials such as sulfur, sulfide and sulfur-containing rubber, amine compounds and amine-containing materials; otherwise, non-curing may occur.

4. Sealed and stored in a cool place, the storage period is six months.

Packing Specification

HY5850 and HY585T: 30kg/set

HY585D and HY585H: 20kg/set, 40kg/set

Safety and Health

HY585 products are non-toxic, the same as general chemicals, and cannot be in contact with food or food utensils. It is recommended to maintain adequate ventilation in the working environment. If it gets into the eyes or mouth, rinse immediately with water. To store in a safe place away from children.