This product is a low-viscosity neutral polymer composite material, one-component, easy to spray, dip and brush. It has good high and low temperature resistance; it forms a transparent protective film after curing, which has excellent insulation, moisture-proof, anti-leakage, vibration-proof, dust-proof, anti-corrosion, anti-aging, corona resistance and other properties. Widely used in surface coating protection of electronic components.
HY5901: Deoxime silica gel, used for coating and protection of PCB electronic components, not suitable for copper and PC materials.
1. Put the glue into the dip bucket for dip coating. The speed of immersion of circuit boards or components should not be too fast to avoid bubbles.。
2. When spraying, put the glue into the spray can and spray. Use thinner to clean the spray can after spraying。
3. If the glue viscosity is high, it can be diluted with thinner. The addition of diluent is large, the viscosity of the glue is low, and the thickness of the glue is thin; on the contrary, the viscosity of the glue is high, and the thickness of the glue is thick. The recommended amount of diluent is 20~40%.